H8C1Z1VBE1

3.3-3.8 GHz, V-pol, 5.5 dBi Gain, Discrete AiP

Type
Antenna
Frequency (GHz)
3.3 ~ 3.8
Insertion loss (dB)
5.5
Switching time (ns)
Vertical
Type
Antenna
Frequency
3.3 ~ 3.8
# of elements
5.5
Output Power (dBm)
Vertical
Type
Antenna
Frequency
3.3 ~ 3.8
Realized Gain (dBi)
5.5
Polarization profile
Vertical
Type
Antenna
Input Frequency (GHz)
3.3 ~ 3.8
LO Frequency (GHz)
5.5
Output Frequency (GHz)
Vertical
Type
Antenna
Frequency (GHz)
3.3 ~ 3.8
Power Level (W)
5.5
Gain (dB)
Vertical
Type
Antenna
Frequency (GHz)
3.3 ~ 3.8
Power Level (W)
5.5
Type
Antenna
Frequency
3.3 ~ 3.8
Gain (dB)
5.5
Secondary features
Vertical
Type
Antenna
Frequency (GHz)
3.3 ~ 3.8
# of elements
5.5
Output Power (dBm)
Vertical
*Specifications may change without notice
Description

The H8C1Z1VBE1 is a surface mounting AiP designed for operation within the FR1 band across 3.3~3.8 GHz featuring linear polarization profiles in vertical direction. It could either 1) used as a unit cell in a linear phased array supporting +/-60 deg beamforming or 2) operates in a discrete manner delivers a realized gain of 5.5 dBi, VSWR < 2, and a 70-degree half-power beamwidth. The antenna is housed in a compact 16 mm x 16 mm footprint with a quad-flat feeding pad, enabling direct connection to a 50-ohm microstrip line on a universal motherboard PCB (wide range of thickness and Dk value) without need for external matching elements. The package has a height of 12.9 mm.

Features
  • 95% radiation efficiency
  • 50-ohm matched Impedance bandwidth 3.3~3.8 GHz (VSWR<2)
  • Beamforming range: +/- 60 deg (embed)
  • Half Power Beam Width: 70 deg (discrete)
  • 16 mm x 16 mm footprint, 12.9 mm height
  • Supporting phased array with pitch distance over 42~50 mm
  • Tool-free integration onto the PCB as a surface-mount device (SMD)
  • Designed for robustness, ensuring compatibility with PCBs across a variety of substrate thicknesses and dielectric constants (Dk)
  • High tolerance on mounting misalignment
  • Only 5 mm edge-to-edge clearance between surrounding components on PCB
Applications
  • 4G/5G macro and micro base-stations
  • Internet of Things
  • Sub-6 GHz Wireless Communications
  • End-user wireless terminal
  • Measurement and instrumentation

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